We deliver the most advanced strategies for your business
Incise is a Design Service Provider startup founded by industry veterans who have served the industry for more than 100 man years, they have a goal of providing the best quality services to their customers and an excellent environment for its employees to work in.
INCISE Infotech Limited is a technology company with the vision of enlightening and igniting the hidden engineer in each one of us by designing the world’s most challenging products which simplifies the life of common people. What ever Incise does it does differently, and strongly believes that the world’s most complex problems are solved in the most simplistic manner.
Incise offers the cutting edge technology services to its clients in the Semiconductor, Embedded System and IT domain. Incise believes in providing the technical help to the partner companies.
Future of Tech Solutions in Incise
- To speed up the delivery of the products to the market to beat the competition
- To provide the expert resources to solve the most challenging technical problems
- Expert knowledge and skills at right time
Incise is a technology focused company which has its strong expertise in all the semiconductor and Embedded Software and IT Services. The open environment at Incise enables engineers to focus on finding the most innovative technology solutions. The hidden engineer within is challenged at every minute while working with Incise Team.











Skills That Make a Meaningful Difference for Your Business
Incise offers the cutting edge technology services to its clients in the Semiconductor, Embedded System and IT domain.

- Bluetooth Low Energy Micro-Controller design & Verification & Implementation
- Universal Flash Storage 2.0 VIP
- DVB-H/T Control Platform delivered as hard macro
- General Purpose 8 bit Microcontroller SOC
- Hearing aid control chip digital design and verification
- Conditional Access Processor for Set-top box applications
- 2G/3G Base band Front end chip verification
- Memory modeling , characterization and re-characterization

- Cost-Effectiveness: Delivering high-quality solutions at competitive prices.
- ODC Engagement: Seamless and scalable offshore development tailored to your needs.
- Skilled Resources: Access to top-tier talent for cutting-edge solutions.
- Timely Delivery: Reliable project timelines with no compromises on quality.
- Reduced Time to Market: Accelerating product launches for a competitive edge.
- Scalability: Rapid adaptation to evolving project demands without extra setup.
- RTL Design: High-quality Register-Transfer Level coding for optimal chip functionality.
- Functional Verification: Ensuring flawless logic and functionality through rigorous testing.
- Synthesis, DFT, Timing: Efficient design synthesis, Design-for-Testability, and precise timing analysis.
- Physical Design and Verification: Accurate layout implementation and thorough physical verification for manufacturability.
- Silicon Validation: Comprehensive post-fabrication testing to ensure silicon meets all specifications.
- Specification and Micro-Architecture: Detailed design blueprints and architecture for robust chip development.

- Latest Technology and Flows :- AI-Driven Design Tools.
– Cloud-Based EDA Solutions.
– Design for Manufacturability (DFM).
– 3D IC Design and Packaging.
– Integration of Photonics and Electronics. - Latest Innovation in the chip making :- Extreme Ultraviolet Lithography (EUV).
– Heterogeneous Integration.
– Quantum Computing Chips.
– High Bandwidth Memory (HBM) and Advanced Interconnects.
– Power and Thermal Optimization. - Issues with latest Libraries which affects Yield :- Inaccurate Characterization of Libraries.
– Impact of Variability in Process Nodes.
– Standard Cell Design Challenges.
– Aging and Reliability.
– EDA Tool Compatibility. - Knowledge about what can break the chip at lower tech nodes and solution :- Critical Design Rule Violations (DRVs).
– Power Integrity and IR Drop.
– Signal Integrity and Crosstalk.
– Electrostatic Discharge (ESD) Failures.
– Thermal Management.
– Defect Density and Mask Complexity.
– Resilience to Process Variations